DATE & TIME

13/06/2019

09:00 - 09:45

DESCRIPTION

Abstract

With the normalization of HPC in the industry, outside the research and academic environments, as well as the burst of Big Data and AI use cases in all sectors, the demand for resources for compute and data hungry applications is increasing exponentially. Therefore, multiplying the horsepower of our compute clusters is a must. In order to make it happen, technology players are refining their chip and platform designs to enable much denser systems.

The trade-off of this trends is chips are getting more and more power hungry, and cooling those components becomes a challenge in terms of sustainability, either for the environment or the economy. In this talk we will present the high density technology landscape and different approaches to address the cooling challenges.

SPEAKER

Miguel Terol

HPC Architect & Solutions Architect Team Lead
Lenovo

LOCATION

Barcelona Advanced Industry Park, Marie Curie, s/n, 08042 - Barcelona (Spain).

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Sponsors

Adamantium

Platinum

Location

  • Parc Tecnològic
  • Marie Curie, 8 08042 Barcelona
  • +34 931640488
  • hpckp@hpcnow.com

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